Optical package module and manufacturing method thereof

Abstract

The present invention provides an optical package module and manufacturing method thereof, which mainly provide a glass substrate with opposite first and second sides, and form a groove on the first side. Then optical engines are placed in the groove, and an electronic component is placed on the glass substrate and electrically connected to the glass substrate, so as to improve the bending resistance of the glass substrate and avoid electrical connection failure caused by warping.

Description

Technical Field

[0001] This invention relates to a semiconductor packaging structure and manufacturing method, and more particularly to an optical packaging module and its manufacturing method. Prior Technology

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, processed, and stored. The demand for data transmission, in particular, is surging, leading industries to replace electricity with light as the data transmission medium. This aims to improve transmission capacity, efficiency, and distance while reducing energy consumption. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technology.

[0003] Please refer to Figure 1, which is a cross-sectional schematic diagram of a conventional co-packaged optical device 1. It mainly has an optical engine 11 disposed on a substrate 10. The optical engine 11 includes an electronic chip 112 formed in the package structure 111 and a photonic chip 113 disposed on the package structure 111. One end of the photonic chip 113 is connected to an optical fiber 14, and a shelf 15 is provided below the junction of the photonic chip 113 and the optical fiber 14 to enable the optical signal to be transmitted to the optical engine 11 for communication. At the same time, a switching chip 12 needs to be disposed on the substrate 10 in order to be used in the end product.

[0004] However, in the aforementioned co-packaged optical devices, the substrate has the disadvantage of being prone to expansion and warping when heated, causing problems in the application of end products.

[0005] Therefore, how to overcome the problems of the aforementioned conventional technologies has become an urgent issue that needs to be addressed. Summary of the Invention

[0006] In view of the various deficiencies of the prior art, the present invention provides an optical packaging module comprising: a glass substrate having a first side and a second side opposite to each other, and a groove formed on the first side; an optical engine disposed in the groove and electrically connected to the glass substrate; and an electronic component disposed on the glass substrate and electrically connected to the glass substrate.

[0007] The present invention further provides a method for manufacturing an optical packaging module, comprising: providing a glass substrate having a first side and a second side opposite to each other, and forming a groove on the first side; disposing an optical engine in the groove and electrically connecting it to the glass substrate; and disposing an electronic component on the glass substrate and electrically connecting it to the glass substrate.

[0008] In the aforementioned optical packaging module and its manufacturing method, a plurality of glass through holes are formed in the glass substrate, which connect the first side and the second side.

[0009] In the aforementioned optical packaging module and its manufacturing method, the groove is formed on the first side and surrounds the edge of the first side.

[0010] In the aforementioned optical packaging module and its manufacturing method, the optical engine includes an electronic chip formed in the packaging structure and a photonic chip disposed on the packaging structure. The photonic chip is electrically connected to the electronic chip through the packaging structure. The electronic chip is an integrated electronic circuit element, and the photonic chip is a photonic integrated circuit element.

[0011] In the aforementioned optical packaging module and its manufacturing method, the electronic component is a switching chip, which is connected to the first side of the glass substrate through a plurality of conductive elements. Furthermore, a filler layer covering the plurality of conductive elements is formed between the electronic component and the glass substrate.

[0012] As can be seen from the above, in the optical packaging module and its manufacturing method of the present invention, a glass substrate is mainly used instead of a plastic substrate to improve the bending resistance and avoid electrical connection failure caused by substrate warping. At the same time, a groove is formed on the surface of the glass substrate to accommodate the optical engine, thereby reducing the overall thickness and size. In addition, a glass through hole is formed in the glass substrate, which allows electronic components to be electrically connected to the glass through hole. In addition to being electrically connected to the glass substrate, it can also be electrically connected to the support structure subsequently placed under the glass substrate, thereby increasing the signal transmission speed. Simple Explanation of the Diagram

[0013] Figure 1 is a cross-sectional schematic diagram of a conventionally co-packaged optical device.

[0014] Figures 2A to 2C are cross-sectional schematic diagrams of the optical packaging module and its manufacturing method of the present invention.

[0015] Figure 3 is a top view schematic diagram of the optical packaging module of the present invention. Implementation

[0016] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0017] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "third," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0018] Please refer to Figures 2A to 2C, which are cross-sectional schematic diagrams of the manufacturing method of the optical packaging module of the present invention.

[0019] As shown in FIG2A, a glass substrate 20 is provided, having a first side 20a and a second side 20b opposite to each other, and at least one groove 200 is formed on the first side 20a (in this example, a plurality of grooves 200 are shown on the first side 20a), and a plurality of glass through-holes (TGVs) 201 communicating with the first side 20a and the second side 20b are formed in the glass substrate 20.

[0020] The glass substrate 20 possesses unique advantages, such as ultra-low flatness (extremely flatness), better thermal stability, and mechanical stability. Because the glass substrate 20 is extremely flat, it improves the focusing depth of photolithography, allowing for a significantly greater number of apertures per square meter of area compared to organic materials. Therefore, the spacing between the glass vias 201 can be less than 100 micrometers, enabling increased interconnect density for subsequent electronic components (chips). Furthermore, the coefficient of thermal expansion of the glass substrate 20 is closer to that of the electronic components, and its higher temperature tolerance reduces deformation and increases reliability.

[0021] Additionally, a circuit layer (e.g., a redistribution layer (RDL)) may be formed on the first side 20a and / or the second side 20b of the glass substrate 20. The groove 200 may be formed by laser cutting or other methods.

[0022] As shown in Figure 2B, an optical engine 21 is provided in each of the grooves 200.

[0023] The optical engine 21 includes an electronic chip 212 formed in the packaging structure 211 and a photonic chip 213 disposed on the packaging structure 211. One end of the photonic chip 213 is connected to an optical fiber 24, and a bracket 25 is provided below the junction of the photonic chip 213 and the optical fiber 24 to enable the optical signal to be transmitted to the optical engine 21 for communication.

[0024] The electronic chip 212 is, for example, an electronic integrated circuit (EIC), and the photonic chip 213 is, for example, a photonic integrated circuit (PIC). Furthermore, the optical engine 21 can be electrically connected to the glass substrate 20 through a plurality of conductive elements.

[0025] As shown in Figure 2C, at least one electronic component 22 is disposed on and electrically connected to the glass substrate 20.

[0026] The electronic component 22 is, for example, a switching chip, which can be placed on the first side 20a of the glass substrate 20 through a plurality of conductive elements 220 and electrically connected to the glass substrate 20. A filling layer 221 covering the plurality of conductive elements 220 can be formed between the electronic component 22 and the glass substrate 20 to obtain the optical packaging module 2 of the present invention.

[0027] In this embodiment, the electronic component 22 can be electrically connected to the glass substrate through the plurality of glass through-holes 201 to improve signal transmission speed.

[0028] Please refer to Figures 2C and 3 in conjunction with the aforementioned manufacturing method. The present invention discloses an optical packaging module 2, which includes: a glass substrate 20 having a groove 200; an optical engine 21 disposed in the groove 200; and an electronic component 22 disposed on the glass substrate 20.

[0029] The glass substrate 20 has a first side 20a and a second side 20b opposite to each other, and a plurality of glass through holes 201 are formed therein. The groove 200 is formed on the first side 20a and surrounds the edge of the first side 20a, and the plurality of optical engines 21 are disposed in the groove 200. The optical engines 21 and the electronic components 22 can be electrically connected to the glass substrate 20 and the subsequent support structure placed below the glass substrate 20 through the glass through holes 201.

[0030] The optical engine 21 includes a package structure 211, an electronic chip 212 embedded in the package structure 211, and a photonic chip 213 disposed on the package structure 211, so that the photonic chip 213 is electrically connected to the electronic chip 212 through the package structure.

[0031] In summary, the optical packaging module and its manufacturing method of the present invention mainly use a glass substrate instead of a plastic substrate to improve the bending resistance and avoid electrical connection failure caused by substrate warping. At the same time, grooves are formed on the surface of the glass substrate to accommodate the optical engine, thereby reducing the overall thickness and size. In addition, glass through-holes are formed in the glass substrate, which allow electronic components to be electrically connected to the glass through-holes. In addition to being electrically connected to the glass substrate, they can also be electrically connected to the support structure placed below the glass substrate, thereby increasing the signal transmission speed.

[0032] The above embodiments are illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the following patent claims.

[0033]

[0034] 1: Co-packaged optical devices

[0035] 10:Substrate

[0036] 11: Optical Engine

[0037] 111: Packaging Structure

[0038] 112: Electronic Chip

[0039] 113: Photonic chip

[0040] 12: Switching Chips

[0041] 14: Optical Fiber

[0042] 15: Bracket

[0043] 2: Optical Packaging Module

[0044] 20: Glass substrate

[0045] 20a: First side

[0046] 20b: Second side

[0047] 200: Groove

[0048] 201: Glass perforation

[0049] 21: Optical Engine

[0050] 211: Packaging Structure

[0051] 212: Electronic Chips

[0052] 213: Photonic chip

[0053] 22: Electronic components

[0054] 220: Conductive component

[0055] 221: Fill layer

[0056] 24: Fiber optic

[0057] 25: Bracket

Claims

1. An optical packaging module, comprising: A glass substrate has a first side and a second side opposite to each other, and a groove is formed on the first side; an optical engine is disposed in the groove and electrically connected to the glass substrate; and an electronic component is disposed on the glass substrate and electrically connected to the glass substrate.

2. The optical packaging module as described in claim 1, wherein, The glass substrate has a plurality of glass perforations that connect the first side and the second side.

3. The optical packaging module as described in claim 1, wherein, The groove is formed on the first side and surrounds the edge of the first side.

4. The optical packaging module as described in claim 1, wherein, The optical engine includes an electronic chip formed in a package structure and a photonic chip attached to the package structure.

5. The optical packaging module as described in claim 4, wherein, The photonic chip is electrically connected to the electronic chip through the packaging structure.

6. The optical packaging module as described in claim 4, wherein, The electronic chip is an electronic integrated circuit element, and the photonic chip is a photonic integrated circuit element.

7. The optical packaging module as described in claim 1, wherein, The electronic component is a switching chip, which is connected to the first side of the glass substrate through a plurality of conductive elements.

8. The optical packaging module as described in claim 7, wherein, A filling layer covering the plurality of conductive elements is formed between the electronic component and the glass substrate.

9. A method for manufacturing an optical packaging module, comprising: A glass substrate having a first side and a second side opposite to each other is provided, and a groove is formed on the first side; an optical engine is disposed in the groove and electrically connected to the glass substrate; and an electronic component is disposed on the glass substrate and electrically connected to the glass substrate.

10. A method for manufacturing an optical packaging module as described in claim 9, wherein, The glass substrate has a plurality of glass perforations that connect the first side and the second side.

11. A method for manufacturing an optical packaging module as described in claim 9, wherein, The groove is formed on the first side and surrounds the edge of the first side.

12. A method for manufacturing an optical packaging module as described in claim 9, wherein, The optical engine includes an electronic chip formed in a package structure and a photonic chip attached to the package structure.

13. A method for manufacturing an optical packaging module as described in claim 12, wherein, The photonic chip is electrically connected to the electronic chip through the packaging structure.

14. A method for manufacturing an optical packaging module as described in claim 12, wherein, The electronic chip is an electronic integrated circuit element, and the photonic chip is a photonic integrated circuit element.

15. A method for manufacturing an optical packaging module as described in claim 9, wherein, The electronic component is a switching chip, which is connected to the first side of the glass substrate through a plurality of conductive elements.

16. A method for manufacturing an optical packaging module as described in claim 15, wherein, A filling layer covering the plurality of conductive elements is formed between the electronic component and the glass substrate.

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