Advanced packaging component with high thermal conductivity and manufacturing method thereof

Abstract

An advanced packaging component with high thermal conductivity and a manufacturing method thereof are provided. The advanced packaging component includes a plate and a three-dimensional thermal conductive pattern. The plate has a first surface and a second surface opposite to the first surface. The plate is made of a high rigidity material and has a heat source contact area. The three-dimensional thermal conductive pattern is formed in the heat source contact area, so as to provide at least one conductive path between the first surface and the second surface which has a heat transfer coefficient of greater than

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