Electronic package and method for forming the same

Abstract

This application provides an electronic package and a method for forming the same. The method includes: providing a substrate having a front surface and a rear surface, wherein at least one electronic component is attached to the front surface of the substrate, and the substrate comprises at least one non-polar material; forming a mold cap on the front surface of the substrate to encapsulate the at least one electronic component; loading the substrate onto a support, wherein the support comprises at least one polar material; and applying microwave radiation to the mold cap and the support to at least partially penetrate the support to cure the mold cap.

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