Method and apparatus for forming semiconductor device

TW202638998APending Publication Date: 2026-09-16JCET STATS CHIPPAC KOREA LTD
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Patent Information

Application Number
TW115121557
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-05-27
Filing Date
2025-05-19
Publication Date
2026-09-16

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Abstract

This application provides a method and apparatus for forming a semiconductor device. The method includes: providing a substrate; mounting at least one electronic component on a surface of the substrate; forming a sealant on the surface of the substrate to seal the electronic component; loading the substrate into a semiconductor device cartridge; and irradiating the sealant with microwave radiation to cure the sealant.
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