Semiconductor package and methods for forming the same

Abstract

A semiconductor package including a lid having a “pre-buckled” configuration. The lid includes a sidewall portion attached to a package substrate and laterally surrounding a package structure including semiconductor die(s), a central portion in thermal contact with the package structure, and a plurality of connecting arms extending between the sidewall portion and the central portion of the lid. The central portion is vertically recessed relative to the sidewall portion and the connecting arms extend in an oblique vertically downward direction between the sidewall portion and the central portion of the lid. Accordingly, during high-temperature conditions, thermal expansion of the connecting arms occurs along a vertically downward direction to displace the central portion towards the package structure. Effective thermal contact between the lid and the package structure may thereby be maintained during high-temperature conditions.

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