Methods and equipment for simultaneously transferring large quantities of micro conductive pillars

Abstract

A method for simultaneously transferring a plurality of micro-conductive pillars includes providing a substrate. A plurality of micro holes are opened on the substrate. A carrier is provided, and a glue layer is provided on a surface of the carrier. The micro-conductive pillars are arranged on the adhesive layer, and the carrier is placed above the substrate. The micro-conductive pillars face the substrate. Through laser beam excitation, the carrier is projected to remove the glue layer located under each micro-conductive pillar, so that each micro conductive pillar falls into each micro hole. Conductive glue is coated on a first surface of the substrate and the conductive glue fills a gap between the micro conductive pillars and the corresponding micro holes. Grind the surfaces of the substrate so that both ends of the micro conductive pillar are flush with the first surface and the second surface respectively.

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