Integration of lithium niobate photonics devices

Abstract

A photonics device package is described. The photonics device package includes a thin film lithium-containing (TFLC) photonics integrated circuit (PIC) and an additional integrated circuit (IC). The TFLC PIC includes TFLC optical structures and electrodes. The TFLC structures include at least one TFLC electro-optic material. At least one of the TFLC structures includes a ridge and a slab and has a width not exceeding one micrometer. The TFLC PIC has a footprint. The TFLC structures occupy not more than fifty percent of the footprint. In addition, the TFLC structures are encapsulated in the TFLC PIC. The additional IC is mechanically coupled with the TFLC PIC after formation of the TFLC structures.

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