Microneedle Device and Method for Manufacturing It

TW202639182APending Publication Date: 2026-10-01HISAMITSU PHARM CO INC
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Patent Information

Application Number
TW115106290
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-25
Filing Date
2026-02-23
Publication Date
2026-10-01

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Abstract

This invention discloses a microneedle device comprising a substrate, microneedles disposed on the substrate, and a coating formed on the microneedles. The coating comprises risperidone or a pharmaceutically permissible salt thereof, chondroitin sulfate or a pharmaceutically permissible salt thereof, and maleic acid. Relative to 100 parts by weight of the coating, the amount of chondroitin sulfate or a pharmaceutically permissible salt thereof is 0.5 parts by weight to 3.5 parts by weight, and the amount of maleic acid is 15 parts by weight to 25 parts by weight.
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