Substrate processing apparatus and substrate processing method

Abstract

This invention describes a substrate processing apparatus and a substrate processing method capable of suppressing the adhesion of foreign matter (e.g., particles) to a substrate. The substrate processing apparatus includes: a rotating holding section, a supply section including a nozzle, a valve disposed in a supply line, a filter disposed between the valve and the nozzle in the supply line, a cup-shaped section, a liquid receiving section, a drive section, and a control section. The control section is configured to perform the following processes: a first process, in which, with the nozzle positioned above the liquid receiving section, the supply section and the valve are controlled to eject processing liquid from the nozzle to the liquid receiving section; and a second process, in which, while continuously ejecting processing liquid from the nozzle as completed in the first process, the drive section is controlled to move the nozzle above the substrate held by the rotating holding section and supply processing liquid to the substrate from the nozzle.

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