Backing layer structure and ultrasonic transducer thereof

TW202639235APending Publication Date: 2026-10-01QISDA CORP
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Patent Information

Application Number
TW114111919
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-28
Publication Date
2026-10-01

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Abstract

A backing layer structure is stacked on a back surface of a piezoelectric layer of an ultrasonic transducer for ultrasonic wave absorption. The backing layer structure includes a powder mixed layer and an epoxy resin adhesive. The powder mixed layer is formed by mixing alumina powder, tungsten powder and quartz powder. The epoxy resin adhesive is filled into the powder mixed layer to be mixed with the alumina powder, the tungsten powder and the quartz powder for solidification.
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