Flying probe butt welding apparatus and butt welding method

Abstract

A flying probe butt welding apparatus is illustrated, and the flying probe butt welding apparatus has a first flying probe butt welding assembly, a second flying probe butt welding assembly, a microcontroller unit and an image sensor. By the control of the microcontroller unit, the first flying probe butt welding assembly and the second flying probe butt welding assembly can move in three dimensions, such that a first tip end of a first butt welding probe can touch a first contact point at a first specific position of a workpiece on a substate, and a second tip end of a second butt welding probe second can touch a contact point at a second specific position on the substate. When the first tip end and the second tip end respectively touch the first contact point and the second contact point, the first butt welding probe and the second butt welding probe are respectively applied with a first voltage and a second voltage, wherein the first voltage is larger than the second voltage, and the first specific position and the second position are non-stationary.

Description

Technical Field

[0001] This invention relates to a spot welding technology, and more particularly to a flying needle spot welding device and spot welding method. Prior Technology

[0002] Spot welding technology allows a welding rod to contact the contacts on a workpiece (e.g., but not limited to a copper foil plate) mounted on a substrate (e.g., but not limited to a silicon substrate), melting the contacts and thus soldering the workpiece to the substrate. Traditionally, spot welding involves raising the temperature of the welding rod to melt the contacts. However, with the increasing number of precision or expensive chips or components in electronic products, raising the temperature of the welding rod may damage these delicate chips or components near the contacts.

[0003] On the other hand, due to the need for thin and small electronic products, the workpieces and the substrate on the board may become increasingly thinner and smaller. Therefore, during spot welding, it is essential to pay attention to the pressure of the welding rod at the contact point with the workpiece to avoid excessive pressure damaging the workpiece and / or the substrate. In addition, in the past, the spot welding process relied on manual inspection to determine whether the welding rod was sticking together. However, this method is not only time-consuming and labor-intensive, but may also lead to poor welding quality if the welding rod is not inspected for sticking.

[0004] Furthermore, traditional spot welding methods involve high current. Since modern chip manufacturing emphasizes energy saving, carbon reduction, and small size, accidentally allowing high current to pass through the chip or substrate during welding can damage the chip. In addition, the substrate and other components can also be damaged by the high current. Summary of the Invention

[0005] As can be understood from the above description, this invention uses a flying probe welding method, providing a flying probe-type spot welding device and method capable of precision welding. By changing the position of the two spot welding contacts through the arrangement of the wafer or component on the substrate, a large current is prevented from passing through the substrate, wafer, or component, thus avoiding damage to the wafer or component. The flying probe-type spot welding device and method of this invention can be used to weld thin workpieces onto a substrate without causing the workpiece and / or substrate to be crushed or damaged by the spot welding rod, and without damaging the precision or expensive wafers or components on the substrate due to the welding workpiece.

[0006] Based on one objective of the present invention, an embodiment of the present invention provides a flying probe welding device, which includes a first flying probe welding assembly, a second flying probe welding assembly, a microcontroller unit, and an image sensor. The first flying probe welding assembly includes a first welding rod having a first tip. The second flying probe welding assembly includes a second welding rod having a second tip. The microcontroller unit is used to determine a first specific position and a second specific position at different times based on a contact map. The image sensor is electrically connected to the microcontroller unit and is used to acquire monitoring images so that the microcontroller unit monitors the first welding rod, the second welding rod, and the substrate. Under the control of the microcontroller unit, the first and second flying probe welding assemblies move in three dimensions, such that the first tip of the first welding rod touches the first contact point of the workpiece on the substrate at the first specific position, and the second tip of the second welding rod touches the second contact point of the substrate at the second specific position. When the first tip and the second tip respectively touch the first contact and the second contact, the first welding rod and the second welding rod are respectively subjected to a first voltage and a second voltage to weld the first contact. The first voltage is greater than the second voltage, and the first specific position and the second specific position are not fixed.

[0007] Based on one objective of the present invention, an embodiment of the present invention provides a spot welding method, which includes the following steps: using a microcontroller unit to determine a first specific position and a second specific position at different times according to a contact map; using an image sensor to acquire monitoring images so that the microcontroller unit monitors a first spot welding rod, a second spot welding rod, and a substrate; using the microcontroller unit to control a first flying probe spot welding assembly and a second flying probe spot welding assembly to perform three-dimensional movement, so that the first tip of the first spot welding rod of the first flying probe spot welding assembly touches the first contact point of the workpiece on the substrate at the first specific position, and the second tip of the second spot welding rod of the second flying probe spot welding assembly touches the second contact point of the substrate at the second specific position; and when the first tip and the second tip respectively touch the first contact point and the second contact point, the first spot welding rod and the second spot welding rod are respectively applied with a first voltage and a second voltage to weld the first contact point, wherein the first voltage is greater than the second voltage, the first specific position and the second specific position are not fixed, and the second specific position at the first time point is different from the second specific position at the second time point.

[0008] As stated above, compared to the prior art, the flying probe welding device and welding method provided by the present invention can not only ensure the quality of welding, but also avoid damage to the precision or expensive chips or components on the substrate. Simple Explanation of the Diagram

[0009] Figure 1 is a front view of the flying needle welding device according to an embodiment of the present invention. Figure 2 is an enlarged schematic diagram of a portion of the flying needle welding device according to an embodiment of the present invention. Figure 3 is a schematic diagram of the substrate according to an embodiment of the present invention. Figure 4 is an enlarged schematic diagram of the workpiece on the substrate according to an embodiment of the present invention. Figure 5 is a functional block diagram of the flying needle welding device according to an embodiment of the present invention. Figure 6 is a schematic flowchart of the spot welding method according to an embodiment of the present invention. Implementation

[0010] The flying-needle spot welding device and method of the present invention use a first spot welding rod and a second spot welding rod to weld the contacts of a workpiece on a substrate through tip discharge. Furthermore, the second specific position corresponding to the second spot welding rod is not fixed on the time axis. Therefore, in addition to ensuring the quality of the weld, it can also prevent damage to precision or expensive chips or components on the substrate. The following will describe in detail the possible embodiments of the present invention with reference to the drawings. However, it should be noted that the following implementation details are not intended to limit the scope of the claims made by the present invention, but are merely for the convenience of those skilled in the art to understand.

[0011] First, please refer to Figure 1, which is a front view of the flying probe welding device according to an embodiment of the present invention. The flying probe welding device is disposed within a housing 100, which has an openable viewing window 101, allowing the operator to place the substrate 200 onto the platform 105 of the flying probe welding device. The platform 105 may have a vacuum hole 106 connected to a vacuum pump, so that the substrate 200 can be adsorbed onto the platform 105 by vacuuming. The platform 105 is further connected to a lifting platform 107. An operation indicator 102, a display screen 103, and operation buttons 104 may be provided at one location in the housing 100, so that the operator can be informed of the status and information of the flying probe welding device and perform corresponding operations.

[0012] Please refer to Figures 1, 2, and 5 simultaneously. Figure 2 is an enlarged schematic diagram of a portion of the flying probe welding device according to an embodiment of the present invention, and Figure 5 is a functional block diagram of the flying probe welding device according to an embodiment of the present invention. The flying probe welding device includes a first flying probe welding assembly, a second flying probe welding assembly, a microcontroller unit 120, and an image sensor 119. The first flying probe welding assembly includes a first welding rod 117 with a first tip. The second flying probe welding assembly includes a second welding rod 118 with a second tip. The microcontroller unit 120 is used to determine a first specific position and a second specific position at different times based on a contact map. The image sensor 119 is disposed on the top plate 108 and electrically connected to the microcontroller unit 120. The image sensor 119 is used to acquire monitoring images so that the microcontroller unit 120 can monitor the first welding rod 117, the second welding rod 118, and the substrate 200.

[0013] Under the control of the microcontroller unit 120, the first and second flying probe welding assemblies move in three dimensions, so that the first tip of the first welding rod 117 touches the first contact point of the workpiece on the substrate 200 at a first specific position, and the second tip of the second welding rod 118 touches the second contact point of the substrate 200 at a second specific position. When the first tip and the second tip touch the first contact point and the second contact point respectively, the first welding rod 117 and the second welding rod 118 are respectively subjected to a first voltage and a second voltage to weld the first contact point. The first voltage is greater than the second voltage, and the first and second specific positions are not fixed. For example, the first voltage is a positive voltage, while the second voltage can be a ground voltage or a negative voltage, and the present invention is not limited thereto.

[0014] Furthermore, the flying needle welding device also includes a first transmission assembly 109, a second transmission assembly 110, a first driver 123, a second driver 124, a first voltage supply 125, and a second voltage supply 126. The first transmission assembly 109 and the second transmission assembly 110 are movably connected to the top plate 108 and are respectively connected to the first flying needle welding assembly and the second flying needle welding assembly. The first transmission assembly 109 and the second transmission assembly 110 are, for example, a three-axis robotic arm or a slide rail device, and the present invention is not limited thereto.

[0015] The first driver 123 is connected to the first transmission assembly 109 and drives the first transmission assembly 109 to move the first flying pin welding assembly in three dimensions so that the first tip of the first welding rod 117 contacts the first contact point. The second driver 124 is connected to the second transmission assembly 110 and drives the second transmission assembly 110 to move the second flying pin welding assembly in three dimensions so that the second tip of the second welding rod 118 contacts the second contact point.

[0016] The microcontroller unit 120 is electrically connected to the first driver 123 and the second driver 124, and is used to control the first driver 123 and the second driver 124 to drive the first transmission assembly 109 and the second transmission assembly 110. The first driver 123 and the second driver 124 can be implemented by servo motors, and the present invention is not limited to the type of the first driver 123 and the second driver 124. The first voltage supply 125 is electrically connected to and controlled by the microcontroller unit 120, and is used to provide a first voltage. The second voltage supply 126 is electrically connected to and controlled by the microcontroller unit 120, and is used to provide a second voltage.

[0017] Furthermore, the second specific position at the first time point is different from the second specific position at the second time point. That is, the second contact point touched by the second tip of the second welding rod 118, which is subjected to the second voltage, may be located near the upper left of the workpiece in the substrate 200 at the first time point, but at the second time point, the second contact point may be located near the upper middle of the workpiece in the substrate 200.

[0018] The first flying probe welding assembly includes a first welding rod 117, a first clamping mechanism 115, a first pressure sensor 113, and a first connector 111. The first clamping mechanism 115 is used to clamp the first welding rod 117, the first connector 111 is connected to the first transmission assembly 109, and the first pressure sensor 113 is connected between the first clamping mechanism 115 and the first connector 111. The second flying probe welding assembly includes a second welding rod 118, a second clamping mechanism 116, a second pressure sensor 114, and a second connector 112. The second clamping mechanism 116 is used to clamp the second welding rod 118, the second connector 112 is connected to the second transmission assembly 110, and the second pressure sensor 114 is connected between the second clamping mechanism 116 and the second connector 112.

[0019] Microcontroller unit 120 is electrically connected to first pressure sensor 113 and second pressure sensor 114. First pressure sensor 113 and second pressure sensor 114 respectively acquire the first pressure of the first tip of the first welding rod 117 contacting the first contact point P1 and the second pressure of the second tip of the second welding rod 118 contacting the second contact point P2. Microcontroller unit 120 controls each of the first and second flying probe welding assemblies to move along a vertical axis based on the first and second pressures, so that the first and second pressures are within a predetermined pressure range. Furthermore, first pressure sensor 113 and second pressure sensor 114 can employ shear beam load cells to facilitate accurate measurement and control of the first and second pressures. However, this invention is not intended to limit the type of first pressure sensor 113 and second pressure sensor 114.

[0020] The flying probe welding device further includes a contact map receiving unit 121 and an electrical measuring device 122. The contact map receiving unit 121 is electrically connected to the microcontroller unit 120 and is used to receive contact maps. The contact maps are determined based on the shape of the workpiece and the arrangement of components and / or chips on the substrate 200, and can be defined manually or mechanically. The contact maps include a first specific position of the first contact at different times and a second specific position of the second contact at different times.

[0021] The electrical measuring device 122 is electrically connected to the microcontroller unit 120, the first soldering rod 117, and the second soldering rod 118, and is used to acquire the impedance value between the first contact P1 and the second contact P2. The microcontroller unit 120 is used to determine whether to solder the first contact P1 based on whether the impedance value is within a predetermined impedance value range, and only controls the first voltage supply 125 and the second voltage supply 126 to provide the first voltage and the second voltage for soldering if the impedance value is within the predetermined impedance value range.

[0022] When the impedance value is not within the predetermined impedance value range, under the condition that the first pressure and the second pressure are within the predetermined pressure range, the microcontroller unit 120 controls each of the first and second flying probe welding assemblies to move on the vertical axis to attempt to bring the impedance value within the predetermined impedance value range. When the first pressure and the second pressure are within the predetermined pressure range, even if the microcontroller unit 120 controls each of the first and second flying probe welding assemblies to move on the vertical axis, it is still unable to bring the impedance value within the predetermined impedance value range. In this case, the welding of the first contact P1 is skipped through the microcontroller unit 120. Simply put, when the impedance value is too small, the first welding rod 117 and the second welding rod 118 can be pressed down to increase the impedance value. Only when the pressure exceeds the warning value (the upper or lower limit of the predetermined impedance value range) is the welding action skipped. That is, during the process, the impedance value and pressure value are monitored in real time to determine whether to perform welding or skip welding.

[0023] Furthermore, the electrical measuring device 122 is used to measure the current and discharge time released by the first welding rod 117, and the microcontroller unit 120 monitors the current and discharge time, thereby controlling the first voltage supply 125 to adjust the current and discharge time. In this way, the current and discharge time of the tip discharge can be precisely monitored and adjusted to achieve good welding quality and avoid damage to the precision or expensive components or chips of the substrate 200.

[0024] After the first contact is spot welded or the first contact is skipped, the first spot welding rod 117 and the second spot welding rod 118 are moved upward under the control of the microcontroller unit 120. The microcontroller unit 120 can determine in real time whether at least one of the first spot welding rod 117 and the second spot welding rod 118 is stuck together based on the first pressure and the second pressure. When it is determined that at least one of the first spot welding rod 117 and the second spot welding rod 118 is stuck together, the first spot welding rod 117 and / or the second spot welding rod 118 that is stuck together is cleaned.

[0025] While the monitoring image from the image sensor 119 can also be used to determine if at least one of the first welding rod 117 and the second welding rod 118 is stuck together, this requires the image sensor 119 to have a certain resolution and requires backend calculations of time and energy consumption, making it impossible to determine in real time whether at least one of the first welding rod 117 and the second welding rod 118 is stuck together. Therefore, determining whether at least one of the first welding rod 117 and the second welding rod 118 is stuck together based on the first pressure and the second pressure can reduce welding time and power consumption.

[0026] Please refer to Figures 3 and 4. Figure 3 is a schematic diagram of the substrate according to an embodiment of the present invention, and Figure 4 is an enlarged schematic diagram of the workpiece on the substrate according to an embodiment of the present invention. A chip 202 and a workpiece 204 to be soldered are disposed on the substrate 200. The substrate 200 may be a silicon substrate, and the workpiece 204 may be a thin copper foil sheet. The first contact P1 at different first specific positions at different times and the second contact P2 at different second specific positions at different times are marked in Figures 3 and 4. The position of the second contact P2 may initially be close to the upper middle of the workpiece 204, but later it may be close to the right middle of the workpiece 204.

[0027] Please refer to Figures 2, 5, and 6. Figure 6 is a schematic flowchart of the spot welding method according to an embodiment of the present invention. First, in step S601, the contact map receiving unit 121 receives the contact map to determine the first specific position and the second specific position at different times, and performs image monitoring, that is, the image sensor 119 acquires the monitoring image so that the microcontroller unit 120 monitors the first spot welding rod 117, the second spot welding rod 118, and the substrate 200. Then, in step S602, the first flying probe spot welding assembly and the second flying probe spot welding assembly are controlled to move in three dimensions so that the first spot welding rod 117 and the second spot welding rod 118 move to the first specific position and the second specific position, respectively, and descend so that the first tip of the first spot welding rod 117 of the first flying probe spot welding assembly touches the first contact point of the workpiece 204 on the substrate 200 at the first specific position, and the second tip of the second spot welding rod 118 of the second flying probe spot welding assembly touches the second contact point of the substrate 200 at the second specific position.

[0028] Then, in step S603, the first pressure sensor 113 of the first flying probe welding assembly and the second pressure sensor 114 of the second flying probe welding assembly are used to obtain the first pressure of the first tip touching the first contact point P1 and the second pressure of the second tip touching the second contact point, respectively, and it is determined whether the first pressure and the second pressure are within a predetermined pressure range. If the first pressure and the second pressure are within the predetermined pressure range, step S604 is executed; otherwise, step S605 is executed. In step S605, the microcontroller unit 120 is used to control each of the first flying probe welding assembly and the second flying probe welding assembly to move on the vertical axis according to the first pressure and the second pressure, so that the first pressure and the second pressure are within the predetermined pressure range.

[0029] In step S604, the electrical measuring device 122 is used to obtain the impedance value between the first contact and the second contact, and the microcontroller unit 120 is used to determine whether to perform spot welding on the first contact based on whether the impedance value is within a predetermined impedance value range. If the impedance value is within the predetermined impedance value range, or if it is within a predetermined pressure range and the impedance value can be adjusted to be within the predetermined impedance value range by adjusting the first pressure and the second pressure, then step S606 is executed; otherwise, step S607 is executed.

[0030] Then, in step S607, under the control of the microcontroller unit 120, the welding of the first contact is skipped, no welding is performed, and the first welding rod 117 of the first flying probe welding assembly and the second welding rod 118 of the second flying probe welding assembly are moved upward. In step S606, the first welding rod 117 and the second welding rod 118 are respectively subjected to a first voltage and a second voltage to weld the first contact. The microcontroller unit 120 will precisely monitor the current released by the first welding rod 117 and the discharge time to achieve precision welding. After the welding of the first contact at the current moment is completed, the first welding rod 117 and the second welding rod 118 are moved upward.

[0031] In step S608, the microcontroller unit 120 determines whether at least one of the first welding rod 117 and the second welding rod 118 is stuck together based on the first pressure and the second pressure. If there is sticking, step S609 is executed to clean the first welding rod 117 and the second welding rod 118; if there is no sticking, step S610 is executed. In step S610, the microcontroller unit 120 determines whether all welding is completed. If so, the entire welding method ends; otherwise, step S602 is executed at the next time point.

[0032] In summary, the flying needle welding device and welding method provided by this invention use two welding rods to touch the contact points of the workpiece and the contact points of the substrate, and apply different voltage differences to form a tip discharge to weld the contact points on the workpiece. The contact points on the substrate are not fixed but vary at different times. Furthermore, in some embodiments, the contact pressure, the impedance value between the two contacts, the discharge current, and the discharge time can be precisely monitored.

[0033] In this way, the flying needle welding device and welding method provided by the present invention can have the following advantages: (1) Precise control of contact pressure, impedance value between two contacts, discharge current and discharge time, etc., to ensure welding quality; (2) The contacts on the substrate are not fixed, so some sharp discharge paths can avoid damage to precision or expensive chips or components on the substrate, or can avoid poor welding quality; (3) The method of judging whether the welding rod is stuck is by pressure monitoring, so the welding rod can be monitored in real time and the stuck welding rod can be cleaned in real time; (4) Precise control of contact pressure to avoid damage to the workpiece and / or substrate by the welding rod; (5) If the impedance value of the two contacts cannot be adjusted to the predetermined impedance value range, the welding of the contacts on the workpiece at this time is skipped to avoid damage to precision or expensive chips or components on the substrate.

[0034] This invention is disclosed herein only by preferred embodiments. However, it should be understood by anyone skilled in the art that the above embodiments are for illustrative purposes only and are not intended to limit the scope of the patent rights claimed by this invention. Any variations or substitutions that are equivalent to or equivalent to the above embodiments should be interpreted as being covered within the spirit or scope of this invention. Therefore, the scope of protection of this invention should be based on the claims defined below.

[0035] 100: Casing 101: Window 102: Operation indicator light 103: Display Screen 104: Operation Buttons 105: Platform 106: Vacuum port 107: Lifting Platform 108: Top Plate 109: First Transmission Assembly 110: Second transmission assembly 111: First connector 112: Second connector 113: First pressure sensor 114: Second pressure sensor 115: First clamping mechanism 116: Second clamping mechanism 117: First welding rod 118: Second welding rod 119: Image Sensor 120: Microcontroller Unit 121: Touch Map Receiving Unit 122: Electrical measuring device 123: First Driver 124: Second Driver 125: First voltage supply unit 126: Second voltage supply 200:Substrate 202: Chip 204: Workpiece S601~S610: Steps P1: First contact point P2: Second contact point

Claims

1. A flying needle type spot welding device, comprising: A first flying probe soldering assembly includes a first soldering rod (117) having a first tip; a second flying probe soldering assembly includes a second soldering rod (118) having a second tip; a microcontroller unit (120) for determining a first specific position and a second specific position at different times according to a contact map; and an image sensor (119) electrically connected to the microcontroller unit (120) for acquiring a monitoring image so that the microcontroller unit (120) can monitor the first soldering rod (117), the second soldering rod (118), and a substrate (200). Under the control of the microcontroller unit (120), the first flying probe welding assembly and the second flying probe welding assembly move in three dimensions, so that the first tip of the first welding rod (117) touches a first contact point (P1) of a workpiece (204) on the substrate (200) at a first specific position, and the second tip of the second welding rod (118) touches a second contact point (P2) of the substrate (200) at a second specific position; when the first tip and the second tip respectively touch the first contact point (P1) and the second contact point (P2), the first welding rod (117) and the second welding rod (118) are respectively applied a first voltage and a second voltage to weld the first contact point (P1), the first voltage is greater than the second voltage, and the first specific position and the second specific position are not fixed.

2. The flying needle welding apparatus as described in claim 1, further comprising: A first transmission assembly (109) and a second transmission assembly (110) are respectively connected to the first flying pin welding assembly and the second flying pin welding assembly; a first driver (123) is connected to the first transmission assembly (109) and is used to drive the first transmission assembly (109) so that the first transmission assembly (109) drives the first flying pin welding assembly to move in three dimensions so that the first tip of the first welding rod (117) touches the first contact point (P1); A second driver (124), connected to the second transmission assembly (110), is used to drive the second transmission assembly (110) so that the second transmission assembly (110) drives the second flying pin welding assembly to move in three dimensions so that the second tip of the second welding rod (118) touches the second contact (P2). The microcontroller unit (120) is electrically connected to the first driver (123) and the second driver (124) and is used to control the first driver (123) and the second driver (124) to drive the first transmission assembly (109) and the second transmission assembly (110). A first voltage supply (125), electrically connected to and controlled by the microcontroller unit (120), is used to provide the first voltage. A second voltage supply (126), electrically connected to and controlled by the microcontroller unit (120), is used to provide the second voltage. The second specific position at a first time point is different from the second specific position at a second time point.

3. The flying needle welding apparatus as claimed in claim 2, wherein the first flying needle welding assembly includes the first welding rod (117), a first clamping mechanism (115), a first pressure sensor (113), and a first connector (111), and the second flying needle welding assembly includes the second welding rod (118), a second clamping mechanism (116), a second pressure sensor (114), and a second connector (112), wherein the first clamping mechanism (115) is used to clamp the first welding rod (118). 7) The first connector (111) is connected to the first transmission assembly (109), the first pressure sensor (113) is connected between the first clamping mechanism (115) and the first connector (111), the second clamping mechanism (116) is used to clamp the second welding rod (118), the second connector (112) is connected to the second transmission assembly (110), and the second pressure sensor (114) is connected between the second clamping mechanism (116) and the second connector (112).

4. The flying needle welding apparatus as claimed in claim 3, wherein each of the first pressure sensor (113) and the second pressure sensor (114) is a shear beam load unit.

5. The flying probe welding apparatus as claimed in claim 3, wherein the microcontroller unit (120) is electrically connected to the first pressure sensor (113) and the second pressure sensor (114), the first pressure sensor (113) and the second pressure sensor (114) respectively acquire a first pressure of the first tip touching the first contact point (P1) and a second pressure of the second tip touching the second contact point (P2), and the microcontroller unit (120) controls each of the first flying probe welding assembly and the second flying probe welding assembly to move on a vertical axis according to the first pressure and the second pressure, so that the first pressure and the second pressure are within a predetermined pressure range.

6. The flying needle welding apparatus as described in claim 5, further comprising: An electrical measuring device (122) is electrically connected to the microcontroller unit (120), the first soldering rod (117), and the second soldering rod (118) to obtain an impedance value between the first contact (P1) and the second contact (P2); wherein the microcontroller unit (120) is used to determine whether to solder the first contact (P1) based on whether the impedance value is within a predetermined impedance value range, and only when the impedance value is within the predetermined impedance value range, controls the first voltage supply (125) and the second voltage supply (126) to provide the first voltage and the second voltage for soldering.

7. The flying needle welding apparatus as claimed in claim 6, wherein when the impedance value is not within the predetermined impedance value range, under the condition that the first pressure and the second pressure are within the predetermined pressure range, the microcontroller unit (120) controls each of the first flying needle welding assembly and the second flying needle welding assembly to move on the vertical axis in an attempt to bring the impedance value within the predetermined impedance value range.

8. The flying needle welding apparatus as claimed in claim 7, wherein when the first pressure and the second pressure are within the predetermined pressure range, even if the microcontroller unit (120) controls each of the first flying needle welding assembly and the second flying needle welding assembly to move on the vertical axis, the impedance value cannot be within the predetermined impedance value range, then the welding of the first contact (P1) is skipped by the microcontroller unit (120).

9. The flying needle welding apparatus as claimed in claim 6, wherein the electrical measuring device (122) is further used to measure a current and a discharge time released by the first welding rod (117), and the microcontroller unit (120) monitors the current and the discharge time and thereby controls the first voltage supply (125) to adjust the current and the discharge time.

10. The flying needle welding device as claimed in claim 6, wherein after welding the first contact (P1) is completed or the welding of the first contact (P1) is skipped, the first welding rod (117) and the second welding rod (118) move upward, the microcontroller unit determines whether at least one of the first welding rod (117) and the second welding rod (118) is stuck together according to the first pressure and the second pressure, and when it is determined that at least one of the first welding rod (117) and the second welding rod (118) is stuck together, the first welding rod (117) and / or the second welding rod (118) are subjected to a cleaning procedure.

11. A spot welding method, comprising: A microcontroller unit (120) is used to determine a first specific position and a second specific position at different times based on a contact map; an image sensor (119) is used to acquire a monitoring image so that the microcontroller unit (120) can monitor a first soldering rod (117), a second soldering rod (118), and a substrate (200); the microcontroller unit (120) is used to control a first flying probe soldering assembly and a second flying probe soldering assembly to perform three-dimensional movement, so that a first tip of the first soldering rod (117) of the first flying probe soldering assembly touches a first contact point (P1) of a workpiece (204) on the substrate (200) at the first specific position, and a second tip of the second soldering rod (118) of the second flying probe soldering assembly touches a second contact point (P1) of the substrate (200) at the second specific position. 2); and when the first tip and the second tip respectively touch the first contact (P1) and the second contact (P2), the first welding rod (117) and the second welding rod (118) are respectively subjected to a first voltage and a second voltage to weld the first contact (P1), wherein the first voltage is greater than the second voltage, the first specific position and the second specific position are not fixed, and the second specific position at a first time point is different from the second specific position at a second time point.

12. The spot welding method as described in request item 11 further includes: The first pressure sensor (113) of the first flying probe welding assembly and the second pressure sensor (114) of the second flying probe welding assembly are used to obtain a first pressure when the first tip touches the first contact point (P1) and a second pressure when the second tip touches the second contact point (P2), respectively; and the microcontroller unit (120) is used to control each of the first flying probe welding assembly and the second flying probe welding assembly to move on a vertical axis according to the first pressure and the second pressure, so that the first pressure and the second pressure are within a predetermined pressure range.

13. The spot welding method as described in request item 12 further includes: An electrical measuring device (122) is used to obtain an impedance value between the first contact (P1) and the second contact (P2); and a microcontroller unit (120) is used to determine whether to perform a short-circuit soldering on the first contact (P1) based on whether the impedance value is within a predetermined impedance value range, and only when the impedance value is within the predetermined impedance value range is a first voltage supply (125) and a second voltage supply (126) controlled to provide the first voltage and the second voltage for short-circuit soldering.

14. The spot welding method as claimed in claim 13, wherein when the impedance value is not within the predetermined impedance value range, under the condition that the first pressure and the second pressure are within the predetermined pressure range, the microcontroller unit (120) controls each of the first flying probe spot welding assembly and the second flying probe spot welding assembly to move on the vertical axis to attempt to bring the impedance value within the predetermined impedance value range; when under the condition that the first pressure and the second pressure are within the predetermined pressure range, even if the microcontroller unit (120) controls each of the first flying probe spot welding assembly and the second flying probe spot welding assembly to move on the vertical axis, it is still impossible to bring the impedance value within the predetermined impedance value range, then the welding of the first contact (P1) is skipped through the microcontroller unit (120).

15. The spot welding method as described in claim 13 further includes: After completing the spot welding or skipping the welding of the first contact (P1), the microcontroller unit (120) is used to control the first spot welding rod (117) and the second spot welding rod (118) to move upward; and the microcontroller unit (120) is used to determine whether at least one of the first spot welding rod (117) and the second spot welding rod (118) is stuck together according to the first pressure and the second pressure, and when it is determined that at least one of the first spot welding rod (117) and the second spot welding rod (118) is stuck together, a cleaning procedure is performed on the first spot welding rod (117) and / or the second spot welding rod (118).

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