Laser processing method and laser processing apparatus

TW202639266APending Publication Date: 2026-10-01TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
TW115110009
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-28
Filing Date
2026-03-17
Publication Date
2026-10-01

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Abstract

A laser processing method includes: a processing step of forming a groove on a surface of a workpiece by irradiating the surface of the workpiece with laser light; a cleaning step of removing, by cleaning, debris deposited around the groove as a result of the formation of the groove; and a kerf check step of, after the cleaning step, acquiring a post-cleaning image of an area around the groove and confirming processing quality of the groove, including a groove formation position, based on the post-cleaning image.
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