Laser processing equipment and control methods

TW202639269APending Publication Date: 2026-10-01HAMAMATSU PHOTONICS KK
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Patent Information

Application Number
TW115100059
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-31
Filing Date
2026-01-02
Publication Date
2026-10-01

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Abstract

The laser processing apparatus (1) includes: a memory unit that stores correction parameters for a correction calculation formula to generate a second branch pattern that makes the measured output value of each branch light detected by the detection unit (17) close to the output target value, i.e., balance parameters set for the position-related information of each light-collecting point; a control unit (9); the control unit (9) performs: a selection process that selects an applicable balance parameter based on the position-related information of the first light-collecting point, the second light-collecting point, and the third light-collecting point; a correction process based on the correction calculation formula of the selected balance parameter; and a display process that generates a second branch pattern based on the correction calculation formula, sets the generated second branch pattern on the reflective spatial light modulator (34) for use in the processing, and displays it.
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