Laser processing apparatus and laser processing method

TW202639274APending Publication Date: 2026-10-01TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
TW115108120
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-13
Filing Date
2026-03-05
Publication Date
2026-10-01

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Abstract

A laser processing apparatus includes a spatial light modulator configured to modulate laser light into modulated light, a polarization element configured to change a polarization state of the modulated light, a focusing lens configured to focus the modulated light whose polarization state has been changed into an interior of a workpiece, and a control unit configured to control the polarization element in accordance with physical properties of the workpiece.
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