Machining apparatus, machining system, and control methods for machining apparatus
TW202639281APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW115102526
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-31
- Filing Date
- 2026-01-22
- Publication Date
- 2026-10-01
Smart Images

Figure TWG2TA001079149_001 
Figure TWG2TA001079149_002 
Figure TWG2TA001079149_003
Abstract
The processing apparatus is used for grinding or lapping. The processing apparatus includes: a rotary disk equipped with processing rollers for grinding or lapping; a spindle motor for rotating the rotary disk; a lifting mechanism for raising and lowering the rotary disk along with the spindle motor; and a frame for housing the rotary disk. The frame has a top plate with an insertion port formed therein for inserting the rotary disk. The processing apparatus further includes: a top cover placed on the top plate, covering at least a portion of the insertion port; and a switching mechanism for switching between a first state and a second state, wherein the first state involves the top cover being raised and lowered independently of the rotary disk (i.e., placed on the top plate), and the second state involves the top cover being raised and lowered in conjunction with the rotary disk.
Need to check novelty before this filing date? Find Prior Art
