Machining apparatus, machining system, and control methods for machining apparatus

TW202639281APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115102526
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-31
Filing Date
2026-01-22
Publication Date
2026-10-01

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Abstract

The processing apparatus is used for grinding or lapping. The processing apparatus includes: a rotary disk equipped with processing rollers for grinding or lapping; a spindle motor for rotating the rotary disk; a lifting mechanism for raising and lowering the rotary disk along with the spindle motor; and a frame for housing the rotary disk. The frame has a top plate with an insertion port formed therein for inserting the rotary disk. The processing apparatus further includes: a top cover placed on the top plate, covering at least a portion of the insertion port; and a switching mechanism for switching between a first state and a second state, wherein the first state involves the top cover being raised and lowered independently of the rotary disk (i.e., placed on the top plate), and the second state involves the top cover being raised and lowered in conjunction with the rotary disk.
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