Endpoint inspection method for processing equipment and edge finishing

Abstract

This invention improves the accuracy of edge finishing endpoint detection. The processing control device 100 includes: a platform 210 for holding and rotating a wafer; a dicing blade 208 and a spindle 206 for edge finishing the outer periphery of the wafer while it is held on the platform 210; an optical device 214 for irradiating the outer periphery of the wafer and receiving reflected light; a beam splitter 212 for splitting the reflected light; and the processing control device 100 for detecting the endpoint of edge finishing. The processing control device 100 generates beam splitting waveform information representing the intensity distribution of the reflected light based on the output data of the beam splitter 212, and detects the endpoint based on the beam splitting waveform information. none

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