Substrate to be attached to electronic device and rolled package of the same

TW202639333APending Publication Date: 2026-10-01TOYO SEIKAN GRP HLDG LTD
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Patent Information

Application Number
TW114148543
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-13
Filing Date
2025-12-11
Publication Date
2026-10-01

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Abstract

The present invention provides a substrate to be attached to an electronic device, including metal foil and a protective resin layer. The protective resin layer is provided on a surface on one side of the metal foil, and the electronic device is attached on the other side of the metal foil. The substrate further includes a hygroscopic resin layer and electrode foil on a surface on the other side of the metal foil in this order of proximity to the surface on the other side of the metal foil. The substrate can prevent moisture permeation, thereby keeping the electronic device dry and preventing the formation of rust on the electrode foil.
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