High-frequency multilayer printed circuit boards

Abstract

[Problem] To provide a high-frequency multilayer printed circuit board with low transmission loss, which uses a printed wiring board in which a resin layer composed of a "polyarylene sulfide resin dispersed with a specific thermoplastic resin" is used as an insulating layer, which has excellent adhesion to an adhesive layer with low dielectric properties, and can be laminated with a printed wiring board composed of an "insulating layer formed by an epoxy glass cloth laminate". [Solution] The above-mentioned problems can be solved by using the following high-frequency multilayer printed circuit board, thereby completing the present invention; the high-frequency multilayer printed circuit board is formed by laminating a printed circuit board (P1) with an adhesive layer having low dielectric properties on at least one side of a printed circuit board (P2) having an insulating layer formed by an epoxy glass cloth laminate, wherein the printed circuit board (P1) uses a resin composition of polyarylene sulfide resin (A) and a thermoplastic resin (B) other than polyarylene sulfide resin with a glass transition temperature of 140°C or higher or a melting point of 230°C or higher as the low dielectric insulating layer. none

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