A multilayer, a method for manufacturing the multilayer, and a method for manufacturing a semiconductor device using the multilayer.

Abstract

The present invention aims to provide a laminate that can transfer a finely and densely mounted semiconductor wafer to a target circuit substrate with high positional accuracy, regardless of the positional offset of the laser light during the transfer of the semiconductor wafer. To solve this problem, the present invention provides a laminate in which a substrate, a resin film, and a semiconductor wafer are sequentially laminated. In the laminate, the resin film has a region with an indentation elastic modulus of 1 MPa or more and 500 MPa or less (the indentation elastic modulus of this region is referred to as "elastic modulus α") and a region surrounding the indentation elastic modulus of the resin film that has an indentation elastic modulus higher than elastic modulus α (the indentation elastic modulus of this region is referred to as "elastic modulus β"). The ratio of elastic modulus α to elastic modulus β, β / α, is a value greater than 1. The semiconductor wafer is laminated on region α.

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