Thermal interface sheet, heat dissipation device, method for manufacturing thermal interface sheet, and resin composition

TW202639348APending Publication Date: 2026-10-01RESONAC CORP
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Patent Information

Application Number
TW115110044
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-19
Filing Date
2026-03-17
Publication Date
2026-10-01

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Abstract

A thermal interface sheet including: a thermal conductive layer containing a thermal conductive filler; and an adhesive layer containing a resin component, a non-sinterable filler, and a sinterable filler, the adhesive layer being located on at least a portion of a main surface of the thermal conductive layer.
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