Photosensitive or radiosensitive linear resin compositions, photoresist films, patterning methods, and manufacturing methods of electronic devices.
TW202639485APending Publication Date: 2026-10-01FUJIFILM CORP
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Patent Information
- Application Number
- TW115100006
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-08
- Filing Date
- 2026-01-02
- Publication Date
- 2026-10-01
Abstract
The present invention provides a photosensitive radioactive or radioactive linear resin composition, a photoresist film using the above-mentioned photosensitive radioactive or radioactive linear resin composition, a pattern forming method, and a method for manufacturing an electronic device. The photosensitive radioactive or radioactive linear resin composition contains: an onium salt compound (I) which includes a cation and an organic anion having a specific structure; an onium salt compound (II) which includes an anion and an onium cation having a specific structure; an acid-degradable resin; and a solvent.
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