Compositions, grinding methods and compounds for chemical mechanical grinding

Abstract

This invention provides a chemical mechanical polishing composition that can increase the polishing speed of molybdenum films and reduce the corrosion of molybdenum films, and a polishing method using the same. The chemical mechanical polishing composition of this invention contains: (A) abrasive particles; (B) a compound having a partial structure represented by the following formula (1) in one molecule; and (F) a liquid medium having a pH of 1 or higher and 5 or lower. (In formula (1), R1 and R2 each independently represent a hydrocarbon group having 1 to 6 carbon atoms, R3 represents an alkyl group having 8 to 20 carbon atoms; X- represents at least one selected from the group consisting of alkyl sulfonates, fluorosulfonates, toluene sulfonates, styrene sulfonates, alkyl sulfonamides, trifluoromethane sulfonamides, Br-, Cl-, SCN-, PF6-, BF4- and trifluoroacetates; * represents a bonding site)

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