Two-component resin composition
TW202639612APending Publication Date: 2026-10-01NIPPON SHOKUBAI CO LTD
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Patent Information
- Application Number
- TW114147401
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-12
- Filing Date
- 2025-12-04
- Publication Date
- 2026-10-01
Abstract
This invention provides a two-component resin composition with good storage stability and good curing properties after storage. The invention relates to a two-component resin composition comprising a liquid A and a liquid B, characterized in that: liquid A contains a reaction promoter, which includes a metal compound; liquid B contains a reaction accelerator, which includes a ketone compound; liquid A and / or liquid B contain a free radical polymerizable monomer; and liquid A and / or liquid B contain inorganic particles with a thermal conductivity of 2 W / m·K or higher. none
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