Photosensitive resin composition, cured material, laminate, manufacturing method of cured material, manufacturing method of semiconductor device and semiconductor device
TW202639618APending Publication Date: 2026-10-01FUJIFILM CORP
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Patent Information
- Application Number
- TW115107899
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-28
- Filing Date
- 2026-03-04
- Publication Date
- 2026-10-01
Abstract
This invention provides a photosensitive resin composition with excellent resolution and nonlinearity, a cured product, a laminate, a method for manufacturing the cured product, a method for manufacturing a semiconductor device, and a semiconductor device. A photosensitive resin composition comprises: a specific compound having a free radical initiation structure and a free radical polymerization inhibition structure, wherein the number m of the free radical initiation structures and the number n of the free radical polymerization inhibition structures satisfy m < n; and a resin, wherein the photosensitive resin composition satisfies at least one of the following conditions A-1 and A-2. Condition A-1: The resin has free radical polymerizable groups. Condition A-2: The photosensitive resin composition further contains a free radical reactive crosslinking agent.
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