Photosensitive resin composition, cured product, transfer film, laminate, production method for cured product, production method for semiconductor device, and semiconductor device

Abstract

The present invention aims to provide a photosensitive resin composition exhibiting high elongation at break and glass transition temperature when formed into a cured material, a cured material, a transfer film, a laminate, a method for manufacturing the cured material, a method for manufacturing a semiconductor device, and a semiconductor device. The photosensitive resin composition of the present invention contains polyimide (A) having a terminal free radical polymerizable group and the proportion of repeating units with free radical polymerizable groups in all repeating units being 20 mol% or less, and a polymerization initiator.