Thermosetting maleimide resin composition for stress-relief layer for glass-core substrate and printed wiring board including the same
TW202639630APending Publication Date: 2026-10-01SHIN ETSU CHEMICAL CO LTD
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Patent Information
- Application Number
- TW115101368
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-24
- Filing Date
- 2026-01-14
- Publication Date
- 2026-10-01
Abstract
A thermosetting maleimide resin composition for a stress-relief layer for a glass-core substrate includes a component (A) that is a maleimide compound having, in one molecule, one or more hydrocarbon groups derived from one or more skeletons selected from dimer diamine skeletons and trimer triamine skeletons, the component (A) being contained in an amount of
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