Polyimide resins, resin compositions, cured products and laminates

Abstract

This invention provides a polyimide resin that provides a layer of cured material exhibiting high adhesion strength and excellent solder heat resistance, whether or not a hardener is used, and also has a low dielectric loss tangent. This invention relates to a polyimide resin, a cured product of the polyimide resin, a laminate having the layer of the cured material, and a polyimide resin comprising a reaction product of tetracarboxylic dianhydride (a1), a diamine (a2), and a (meth)acrylate having an isocyanate group (a3), wherein component (a2) of the polyimide resin comprises a diamine derived from a dimeric acid and a diamine containing a carboxyl group, and the molar ratio of the diamine derived from the dimeric acid to 100 molars of component (a2) is 35 molar% to 80 molars.