Epoxy resin, method of manufacturing epoxy resin, epoxy distillate, method of manufacturing epoxy distillate, curable composition, cured product, and method of manufacturing cured product
TW202639659APending Publication Date: 2026-10-01ADEKA CORP
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Patent Information
- Application Number
- TW114145119
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-22
- Filing Date
- 2025-11-19
- Publication Date
- 2026-10-01
Abstract
An epoxy resin is provided that contains a compound represented by formula (1) below, and has a total chlorine content of 90 ppm or more and 300 ppm or less. (In the formula, R¹ independently represents a hydrogen atom or a methyl group, and R² independently represents a hydrogen atom or a methyl group.)
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