Epoxy resin mixture, curable resin composition, and cured product thereof

TW202639662APending Publication Date: 2026-10-01NIPPON KAYAKU CO LTD
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Patent Information

Application Number
TW115102686
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-23
Filing Date
2026-01-22
Publication Date
2026-10-01

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Abstract

and X is represented by any one of the following formulas (a) to (g). In formulas (a) to (g), pluralities of R1, R2, p, and q, if present, are each independent; R1 represents a hydrogen atom, an alkyl group having
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