Thermosetting resin composition and power module

Abstract

This invention provides a thermosetting resin composition comprising an epoxy resin containing an epoxy compound represented by formula (1), a hardener, and an inorganic filler, wherein m is 2 and n is 2. The glass transition temperature of the thermosetting resin composition, measured using thermomechanical analysis (TMA) at a heating rate of 5°C / min, is 190°C or higher. The grain shear strength of the thermosetting resin composition against copper at 230°C, measured by the following <step>, is 3.0 MPa or higher. <Step> The thermosetting resin composition is formed using a low-pressure transfer molding machine at a mold temperature of 175°C, an injection pressure of 10 MPa, and a curing time of 120 seconds. Four 10 mm² test pieces are formed on a copper lead frame under the same test conditions. Next, the grain shear strength between the test pieces and the copper lead frame is measured at 230°C using an automatic grain shear strength measuring device. The grain shear strength of the four test pieces is used. none

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