Photosensitive resin composition, photosensitive element, printed circuit board, and method for manufacturing the printed circuit board

TW202639667APending Publication Date: 2026-10-01RESONAC CORP
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Patent Information

Application Number
TW115107763
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-25
Filing Date
2026-03-04
Publication Date
2026-10-01

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Abstract

A photosensitive resin composition comprising: a resin having ethylene unsaturated bonds and acidic groups; a photopolymerizable compound; and a photopolymerization initiator having a basal skeleton, wherein the content of polybutadiene elastomer is 0 to 2.0% by mass, based on the total solid content of the photosensitive resin composition.
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