Epoxy resin composition, cured material, semiconductor device, and method for manufacturing semiconductor device

TW202639670APending Publication Date: 2026-10-01NAMICS CORPORATION
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Patent Information

Application Number
TW114145557
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-27
Filing Date
2025-11-21
Publication Date
2026-10-01

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Abstract

This invention provides an epoxy resin composition that provides a hardened material that is difficult to peel off from copper pillars. This invention also provides a hardened version of the above-mentioned epoxy resin composition, a semiconductor device having the above-mentioned hardened material, and a method for manufacturing the same. The epoxy resin composition of this invention comprises epoxy resin (A), a hardener (B), and an inorganic filler (C), wherein the glass transition temperature of the hardened material is 120~220°C, and the storage elasticity of the hardened material at 25°C is 6.0 GPa or higher.
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