resin composition

Abstract

The purpose of this disclosure is to provide a resin composition that, after curing, maintains long-term reliability even at high temperatures. The resin composition disclosed herein is characterized by comprising an epoxy compound (A), an acid anhydride (B), a silica filler (C), a curing accelerator (D), and a flame retardant (E) containing phosphorus components, and has a glass transition temperature (Tg) of 160°C or higher, and is liquid at room temperature. Preferably, it is cured to a shape 2 mm thick, 3 cm wide, and 5 cm long, and the thickness change rate after heating at 200°C for 1000 hours is less than 5%. none