Conductive paste, RFID inlay, and manufacturing method of RFID inlay

TW202639674APending Publication Date: 2026-10-01SEKISUI CHEMICAL CO LTD
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Patent Information

Application Number
TW115101656
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-15
Filing Date
2026-01-15
Publication Date
2026-10-01

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Abstract

This invention provides a conductive paste that can 1) improve storage stability; 2) improve adhesion when installed in a relatively short time; and 3) improve conductivity reliability when installed in a relatively short time. The conductive paste of this invention contains a thermosetting compound, a thermosetting agent, a conductive filler, and a non-conductive filler. The non-conductive filler includes a stabilizer, and the weight gain of the stabilizer after being placed at 25°C and 50% RH for 24 hours is 0.50% by weight or more.
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