Conductive paste, RFID inlay, and manufacturing method of RFID inlay

Abstract

This invention provides a conductive paste that can 1) improve dispensing stability; 2) improve storage stability; and 3) improve curing properties when installed in a gaseous atmosphere such as the atmosphere, at relatively low temperatures, and for a relatively short time. The conductive paste of this invention contains a cationic polymerizable compound, a polymerization initiator, and a conductive filler. The cationic polymerizable compound includes an oxobutane compound or an epoxy compound, the polymerization initiator includes a strontium salt or an ammonium salt, and the viscosity of the conductive paste at 25°C is 10 Pa·s to 100 Pa·s.

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