Polyimide resin composition and polyimide film
TW202639688APending Publication Date: 2026-10-01MITSUBISHI GAS CHEM CO INC
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Patent Information
- Application Number
- TW115101606
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-16
- Filing Date
- 2026-01-15
- Publication Date
- 2026-10-01
Abstract
Provided is a polyimide resin composition capable of obtaining a polyimide film excellent in transparency, light resistance, and adhesion to a substrate, and to provide a polyimide film excellent in transparency, light resistance, and adhesion to a substrate. A polyimide resin composition containing: a polyimide resin
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