Photosensitive resin composition, cured product, laminate, production method for cured product, production method for semiconductor device, and semiconductor device

Abstract

The present invention aims to provide a photosensitive resin composition exhibiting high elongation at break and glass transition temperature when cured, a cured product, a laminate, a method for manufacturing the cured product, a method for manufacturing a semiconductor device, and a semiconductor device. The photosensitive resin composition of the present invention comprises: a polyimide precursor (A) having an imidization rate of 30-90% and having the following partial structure; and a polymerization initiator (B). X represents a trivalent or higher group. R represents a monovalent group. Compounds with OH groups bonded to R, i.e., R-OH, have a boiling point of 200°C or lower at 1 atmosphere. n represents an integer of 1 or higher.