Resin composition, method of producing cured product, cured product, and electronic component
TW202639692APending Publication Date: 2026-10-01HD MICROSYSTEMS LTD
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Patent Information
- Application Number
- TW115111153
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-25
- Filing Date
- 2026-03-24
- Publication Date
- 2026-10-01
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Figure TWG2TA001079643_001 
Figure TWG2TA001079643_002
Abstract
A resin composition, comprising a resin that is at least one of a cyclized resin or a precursor of the cyclized resin, an alcohol having two or more carbon atoms, and an adhesion promotor, wherein each of a content of N-methylpyrrolidone and a content of methanol is independently less than
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