Resin composition, cured product, transfer film, cured product production method, laminate production method, semiconductor device production method, and semiconductor device

Abstract

Provided are a resin composition capable of forming a pattern having excellent developability and a high residual film rate, a cured product, a transfer film, a cured product production method, a laminate production method, a semiconductor device production method, and a semiconductor device. The resin composition includes: a polybenzoxazole precursor (A) containing no fluorine atom; and a solvent (B), and an acid value of an acid group contained in the polybenzoxazole precursor (A) and having a neutralization point in a range of