Photosensitive resin composition

Abstract

A photosensitive resin composition for manufacturing optical waveguides with excellent processability is provided. The photosensitive resin composition for manufacturing optical waveguides comprises an organopolysiloxane satisfying both (α) and (β) of the following, or a combination comprising an organopolysiloxane satisfying only (α) and an organopolysiloxane satisfying only (β). Requirement (α): Containing at least one of a T unit with a structure of three siloxane bonds and one organic group bonded to one silicon atom, a Q unit with a structure of four siloxane bonds bonded to one silicon atom, and a cyclic siloxane structure. Requirement (β): Containing an epoxy group, and the refractive index of the cured material at a wavelength of 1310 nm is less than 1.5.

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