High-adhesion polyimide composite film applicable to flexible copper-clad laminates and its preparation method

Abstract

This invention discloses a highly adhesive polyimide composite film for use in flexible copper-clad laminates and its preparation method. The polyimide composite film comprises a thermosetting polyimide support layer and a thermoplastic polyimide adhesive layer disposed on at least one side of the thermosetting polyimide support layer. An interface layer formed by the reaction of terminal amino-terminated hyperbranched polyimide-grafted silica particles with thermosetting polyamide is embedded between the thermosetting polyimide support layer and the thermoplastic polyimide adhesive layer. The end groups of the thermoplastic polyimide contain imidazole rings that can form complexes with copper. In this invention, by embedding terminal amino-terminated hyperbranched polyimide-grafted silica particles at the interface between the thermosetting layer and the thermoplastic layer, the contact area between the support layer and the adhesive layer is increased. Simultaneously, through the complexation effect of the imidazole rings with copper, a polyimide composite film with high adhesion, high dimensional stability, high heat resistance, and low glass transition temperature is prepared.

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