Resin composition, hardened film, pattern manufacturing method, transfer film and printed wiring board

Abstract

The present invention aims to provide a resin composition capable of forming a film with low dielectric loss tangent and low coefficient of linear expansion, and to provide a curing film, a pattern manufacturing method, a transfer film, and a printed wiring board related to the above-mentioned resin composition. The resin composition of the present invention contains organic pigments and resin, wherein the water content of the organic pigments is 1.50% by mass or less, the content of the organic pigments is more than 10% by mass relative to the total solids content in the resin composition, and the acid value of the resin is less than 50 mg KOH / g.

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