Resin composition for molding, electronic component device, and method for manufacturing electronic component device
TW202639719APending Publication Date: 2026-10-01RESONAC CORP
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Patent Information
- Application Number
- TW115110055
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-19
- Filing Date
- 2026-03-17
- Publication Date
- 2026-10-01
Abstract
A resin composition for molding including a curable resin and an inorganic filler having a top-cut diameter of
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