Hollow silica particles, inorganic fillers, slurries, and resin compositions containing hollow silica particles, and methods for manufacturing hollow silica particle materials.

TW202639724APending Publication Date: 2026-10-01ADMATECHS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115110722
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-25
Filing Date
2026-03-20
Publication Date
2026-10-01

Smart Images

  • Figure TWG2TA001079629_001
    Figure TWG2TA001079629_001
  • Figure TWG2TA001079629_002
    Figure TWG2TA001079629_002
Patent Text Reader

Abstract

A hollow silicon dioxide particle has one or more shells composed mainly of silicon dioxide inside the particle, which isolate the particle from the outside. When the hollow silicon dioxide particle is heated from 200°C to 550°C, the first amount of water removed from the hollow silicon dioxide particle is set as A [ppm]. When heated from 550°C to 900°C, the second amount of water removed from the hollow silicon dioxide particle is set as B [ppm]. Between the first amount of water removed and the second amount of water removed, 0.5 < (A / B) < 2.2 is satisfied.
Need to check novelty before this filing date? Find Prior Art