Hollow silica particles, inorganic fillers, slurries, and resin compositions containing hollow silica particles, and methods for manufacturing hollow silica particle materials.
TW202639724APending Publication Date: 2026-10-01ADMATECHS CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW115110722
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-25
- Filing Date
- 2026-03-20
- Publication Date
- 2026-10-01
Smart Images

Figure TWG2TA001079629_001 
Figure TWG2TA001079629_002
Abstract
A hollow silicon dioxide particle has one or more shells composed mainly of silicon dioxide inside the particle, which isolate the particle from the outside. When the hollow silicon dioxide particle is heated from 200°C to 550°C, the first amount of water removed from the hollow silicon dioxide particle is set as A [ppm]. When heated from 550°C to 900°C, the second amount of water removed from the hollow silicon dioxide particle is set as B [ppm]. Between the first amount of water removed and the second amount of water removed, 0.5 < (A / B) < 2.2 is satisfied.
Need to check novelty before this filing date? Find Prior Art
