Thermosetting resin composition, dry film and cured product
TW202639725APending Publication Date: 2026-10-01TAIYO HOLDINGS CO LTD
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Patent Information
- Application Number
- TW115107878
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-17
- Filing Date
- 2026-03-04
- Publication Date
- 2026-10-01
Abstract
This invention provides a novel thermosetting resin composition, dry film, and cured product that possess both a high relative permittivity (Dk) and a low dielectric loss factor (Df). The thermosetting resin composition comprises: polyphenylene ether (A); an inorganic filler (B) selected from one or more of the group consisting of calcium titanate and strontium titanate; and an elastomer (C); wherein the inorganic filler (B) comprises 40-80% by volume relative to the total solid content of the thermosetting resin composition.
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