Resin compositions, resin sheets, laminates, cured sheets, and circuit board materials

Abstract

This invention provides the following resin composition as a resin composition capable of manufacturing sheet curing materials and circuit board materials with low dielectric properties and heat resistance and uniformity. The resin composition of this invention contains a matrix resin, a compound (B) having a repeating unit represented by the following general formula (1), and a compound (C) represented by the following general formula (3). (In formula (1), R11 represents a hydrogen atom or an alkyl group, R12 and R13 each independently represent a hydrogen atom, an alkyl group, or an aromatic hydrocarbon cyclic group, R14 each independently represents an oxygen atom, a substituent-containing alkyl group, or a substituent-containing aromatic hydrocarbon cyclic group, Ar11 each independently represents a substituent-containing aromatic hydrocarbon cyclic group, and Q11 each independently represents a specific crosslinking group that can have a substituent. n11 is an integer of 0 to 10, n12 is an integer of 0 to 5, and n13 is an integer of 1 to 2). (In formula (3), C represents a carbon atom, H represents a hydrogen atom, A represents each of the specific substituents, and x represents an integer from 0 to 2).