Compositions, hardeners, resin compositions, epoxy resin compositions, sealing materials, conductive materials, thermally conductive materials, insulating materials, adhesives for camera modules, adhesives for structures, matrix resins for fiber-reinforced plastics, impregnated curing agents, interlayer insulating films, thin-film solder resists, sealing sheets, conductive films, anisotropic conductive films, thermally conductive films, semiconductor packaging and electronic devices.

Abstract

The object of this invention is to provide compositions, hardeners, resin compositions, and epoxy resin compositions that improve adhesion strength. Specifically, this invention provides a composition comprising a compound represented by a specific formula.

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