Adhesive film and method for manufacturing electronic device
TW202639739APending Publication Date: 2026-10-01MITSUI CHEM ICT MATERIA INC
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Patent Information
- Application Number
- TW115105570
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-07
- Filing Date
- 2026-02-12
- Publication Date
- 2026-10-01
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Abstract
and a cationic curable resin layer (A), wherein the cationic curable resin layer (A) contains a cationic curable compound and an acid generator, and the cationic curable resin layer (A) is the outermost layer.
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