FRP precursors, FRP, metal-clad laminates, printed circuit boards and semiconductor packages

Abstract

An FRP precursor is provided, which exhibits good laser processing precision and suppresses variations in dimensional change rate. Furthermore, an FRP is provided, which exhibits good laser processing precision and suppresses variations in dimensional change rate. Additionally, a printed circuit board and a semiconductor package are provided. An FRP precursor comprises: glass cloth, and a thermosetting resin composition or a semi-cured form of the aforementioned thermosetting resin composition, wherein the glass cloth, as defined by the following formula, has a K (%) of 30 or less, where A represents the warp width (μm), B represents the cross width (μm), a represents the distance between warp yarns (μm), and b represents the distance between cross yarns (μm). none

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