Silicone thermal conductive composition

TW202639745APending Publication Date: 2026-10-01MOMENTIVE PERFORMANCE MATERIALS INC
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Patent Information

Application Number
TW114148388
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-06-02
Filing Date
2025-12-10
Publication Date
2026-10-01

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Abstract

weight percent of an optional additive and relates to an electronics package structure comprising the silicone thermal conductive composition.
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